Aluminum nitride ceramics have excellent thermal conductivity (5-10 times that of alumina ceramics), low dielectric constant and dielectric loss, reliable insulation properties, excellent mechanical properties, non-toxic, high temperature resistance, chemical corrosion resistance , and is close to the thermal expansion coefficient of silicon. As a new generation of ceramic materials, it has attracted more and more attention and attention, and is widely used in communication devices, high-brightness LEDs, power electronic devices and other industries.

Aluminum Nitride Ceramic Substrate

characteristic:

Compared with alumina, it has about 7 times higher thermal conductivity.

Close to the thermal expansion coefficient of silicon, enabling high reliability for loading large silicon chips and thermal cycling.

Has high electrical insulation and low dielectric constant.

Has better mechanical strength than alumina.

Good corrosion resistance to molten metal

Impurity content is very small, non-toxic, high purity.

application:

Heat dissipation substrates, LED packaging substrates, semiconductor substrates, thin film circuit substrates, power resistor substrates