There must be many people who do not know what is the use of the ceramic substrate made of aluminum nitride ceramics? Or where is the ceramic substrate used? Let's talk to you about aluminum nitride ceramic substrates.
Aluminum Nitride (AlN) is a synthetic mineral that does not occur naturally in nature. The crystal structure of AlN is hexagonal wurtzite type, which has the advantages of low density (3.26g/cm3), high strength, good heat resistance (decomposition at about 3060°C), high thermal conductivity, and corrosion resistance. AlN is a strong covalent bond compound, and its thermal conduction mechanism is lattice vibration (ie, phonon heat transfer). Due to the small atomic numbers of Al and N, AlN has a high thermal conductivity, and its theoretical value can be as high as 319W/m·K. However, in actual products, because the crystal structure of AlN cannot be completely uniformly distributed, and there are many impurities and defects, its thermal conductivity is generally only 170-230W/m·K.
Aluminum nitride ceramic substrate:
It has excellent thermal conductivity, low dielectric constant and dielectric loss, and reliable insulation performance;Excellent mechanical properties, non-toxic, high temperature resistance, chemical corrosion resistance;
Because the aluminum nitride substrate has excellent thermal, mechanical, electrical properties, high thermal conductivity, high strength and other excellent characteristics. With the rapid development of microelectronic devices, aluminum nitride substrates with high thermal conductivity can be widely used. Aluminum nitride ceramic substrate, and the thermal expansion coefficient is similar to that of silicon, as a new ceramic material, it has attracted people's attention and attention. Widely used in communication devices, high brightness LED, power electronic devices and other industries.
The thermal conductivity of aluminum nitride single crystal is about 250W. In theory, the thermal conductivity of aluminum nitride single crystal can reach 320W at room temperature, so aluminum nitride material is very suitable for manufacturing high heat dissipation substrates;Aluminum nitride ceramic substrate is a new type of material to solve the problem of high heat dissipation density. It is most suitable for ceramic substrates for hybrid integrated circuits with high integration and high heat dissipation and ceramic substrates for semiconductor chip mounting.